3D NAND

Toshiba Reveals Restructuring Plans

Toshiba's Yokkaichi Manufacturing ComplexOn Friday Toshiba revealed its restructuring plans aimed at returning the company to profitability and growth through management accountability.

Of special interest to The SSD Guy was the fact that the company will refocus its semiconductor and HDD businesses, currently called the “Semiconductor & Storage Products Company” partly by giving it a new name: “Storage & Electron Devices Company”.  This division will focus on the semiconductor group’s good prospects and profitability while maintaining a focus on the fact that SSDs and HDDs share a business.  In the not-too-distant past Toshiba has run these two businesses separately.

The group plans to be “A pillar of income with Memories as a core business”.  To achieve this, Toshiba has stated that it will enhance its NAND cost competitiveness by accelerating development of BiCS (Toshiba’s 3D NAND technology) and by expanding the SSD business.   There are three parts to this Continue reading

Comparing Samsung’s Planar and V-NAND SSDs

Samsung 3D V-NAND Press PhotoSamsung recently introduced  its 3D V-NAND-based 850 SSD which, according to The Tech Report, uses the same MEX controller as the company’s 3-bit planar SSD, the 840, introduced last year.

Samsung said in its keynote speech at the 2013 Flash Memory Summit that V-NAND consumes an average of 27% less power and runs at least 20% faster than its planar counterpart in an SSD application, all while providing ten times the endurance.  It’s only natural to assume that this would allow designers to produce a V-NAND SSD that would significantly outperform its planar NAND counterpart.

The SSD Guy had an opportunity to review Continue reading