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An ReRAM SSD Design

Chuo University EmblemA colleague pointed The SSD Guy to an ExtremeTech article about researchers at Japan’s Chuo University who have designed an SSD that uses a resistive RAM (ReRAM) as a buffer and is built using TSV technology.  The design was presented at the IEEE’s 2012 Symposium on VLSI Circuits this month in Hawaii.  A Nikkei article gives additional information.

The basic architecture reminds me of an FRAM + NAND SSD design that a Korean university presented at the Flash Memory Summit a few years ago.  Either approach gets past the problem of using a failure-prone battery, a temperature-sensitive supercap, or a big bulky bank of Continue reading

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Jim Handy
Objective Analysis
SSD Market Research
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Jim.Handy (at) Objective-Analysis.com

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